chip packaging

Intel’s chip packaging draws big tech as TSMC hits capacity limits

As demand for advanced AI chip packaging continues to outstrip supply, Intel is positioning its EMIB-T technology as a viable alternative to TSMC's Taiwan Semiconductor Manufacturing Company Limited dominant CoWoS platform — and major chip designers are taking notice.

Intel solves key barrier to building hyper-large AI chips

Intel has disclosed a series of breakthroughs in advanced chip packaging at its Rio Rancho, New Mexico facility, solving a key encapsulation challenge that clears the path for hyper-large chip packages scaling to 24 times the standard reticle size —…

TSMC fast-tracks next-gen chip packaging for 2028

TSMC Taiwan Semiconductor Manufacturing Company reported record consolidated revenue of NT$416.975 billion (approximately $13.17 billion) for May 2026, a 30.1% increase from the same month a year earlier and a 1.5% rise from April, the company disclosed on June 10.…