advanced packaging

TSMC plans to double AI chip packaging capacity by 2028

Taiwan Semiconductor Manufacturing Company is preparing to double its advanced chip packaging capacity by the end of 2028, according to Taiwanese media reports, as demand for AI processors continues to outstrip supply and push overflow orders to rival firms.

TSMC targets 50x computing boost by 2029 with advanced packaging

TSMC Taiwan Semiconductor Manufacturing Company Limited outlined an aggressive technology roadmap on Monday at SEMICON Taiwan 2026, projecting that its SoIC and CoWoS advanced packaging technologies will deliver a 50-fold increase in system computing performance over 2024 levels by 2029,…

SK Hynix becomes Intel packaging customer for AI memory chips

Intel Foundry has secured SK Hynix as a customer for its Embedded Multi-die Interconnect Bridge (EMIB) advanced packaging technology, marking a milestone in Intel's push to become a major packaging provider for the AI chip industry.

TSMC’s packaging crunch pushes AI chip orders to Intel’s Malaysia plants

TSMC's Taiwan Semiconductor Manufacturing Company Limited advanced packaging capacity remains fully booked through 2027, and the sustained crunch is now reshaping competitive dynamics in the semiconductor supply chain. According to a report from Taiwan's Economic Daily News, cited by TrendForce,…

TSMC reportedly in talks to buy two AUO plants for $930M

TSMC Taiwan Semiconductor Manufacturing Company Limited is reportedly in advanced negotiations to acquire two idle panel plants from AU Optronics in a deal worth more than NT$30 billion (roughly $930 million), according to Taiwan's Economic Daily News. The facilities, designated…

MediaTek to use Intel packaging for AI chips

TSMC Taiwan Semiconductor Manufacturing Company Limited is ramping up outsourcing of the chip-on-wafer step in its advanced CoWoS packaging process to partners including ASE Technology and Amkor Technology, as persistent capacity constraints continue to limit the supply of AI chips.…