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Taiwan Semiconductor Manufacturing Company (TSMC) has completed development and validation of its 1.6-nanometer A16 process node, with mass production targeted for the fourth quarter of 2026, according to Taiwanese supply chain reports published on August 20.

ASML Holding finds itself at the center of a widening strategic divide among the world's largest chipmakers, as its next-generation High-NA EUV lithography machines — priced at roughly $400 million each — push Intel and TSMC Taiwan Semiconductor Manufacturing Company…

TSMC's Taiwan Semiconductor Manufacturing Company Limited advanced packaging capacity remains fully booked through 2027, and the sustained crunch is now reshaping competitive dynamics in the semiconductor supply chain. According to a report from Taiwan's Economic Daily News, cited by TrendForce,…

Intel Corporation announced on Monday a $15 billion underwritten public offering of common stock, its largest equity raise in years, as the chipmaker moves to capitalize on surging demand for artificial intelligence infrastructure.

SoftBank Group reported fiscal first-quarter net income of ¥347.3 billion ($2.2 billion) on Thursday, down 18% year-on-year but more than double the analyst consensus estimate of roughly ¥166 billion, powered by an ¥1.33 trillion gain on its stake in Intel.

TSMC Taiwan Semiconductor Manufacturing Company Limited is ramping up outsourcing of the chip-on-wafer step in its advanced CoWoS packaging process to partners including ASE Technology and Amkor Technology, as persistent capacity constraints continue to limit the supply of AI chips.…

Intel has disclosed a series of breakthroughs in advanced chip packaging at its Rio Rancho, New Mexico facility, solving a key encapsulation challenge that clears the path for hyper-large chip packages scaling to 24 times the standard reticle size —…

Intel delivered its strongest quarterly revenue growth in over a decade on Thursday, but investors on Friday punished the stock after the chipmaker raised its capital expenditure forecast to more than $20 billion for 2026 — up from a prior…

Intel CEO Lip-Bu Tan confirmed during the company's second-quarter 2026 earnings call on Thursday that Intel has fully committed to high-volume production of its next-generation 14A manufacturing process in 2028, pulling the timeline forward from the original 2029 target. The…

Intel posted second-quarter 2026 revenue of $16.1 billion on Thursday, a 25% increase from a year earlier that the company called its strongest quarterly growth in more than fifteen years. The results far exceeded the company's own guidance of $13.8…

Intel and Advanced Micro Devices are entering longer-term purchase commitments with Chinese server customers for data center processors as prices surge, Reuters reported on Wednesday, citing two people familiar with the talks.

U.S. semiconductor stocks staged a broad rebound on Tuesday, with memory and processor makers leading a rally that helped major indexes snap a three-day losing streak. The surge came amid multiple catalysts, including a report that TSMC Taiwan Semiconductor Manufacturing…

Intel is dramatically reshaping its manufacturing strategy for its upcoming Nova Lake processors, planning to produce 80-90% of compute tiles internally on its 18A process node — a reversal from earlier plans that had assigned a larger role to TSMC…

ASML announced on Tuesday that Intel Foundry has begun high-volume manufacturing of select Intel Core Ultra Series 3 processors, code-named Panther Lake, using ASML's next-generation High NA EUV lithography technology on the Intel 18A process node. The milestone marks the…

Intel announced on Monday a €5 billion ($5.7 billion) capital investment at its Leixlip campus in Ireland, marking the chipmaker's latest move to expand semiconductor manufacturing capacity as demand for AI processors continues to surge.

Intel has revealed its Starfire processor, a space-grade system-on-chip built on the company's 18A process node, marking the first time the chipmaker's most advanced manufacturing technology has been designed for use in orbit.

Intel has fixed the wafer-to-wafer yield variability that plagued early production of its 18A process node, according to a report from BlueFin Research Partners published this week. Combined output from the company's Oregon and Arizona fabrication facilities has reached approximately…

Google Alphabet Inc. is set to abandon TSMC's Taiwan Semiconductor Manufacturing Company Limited dominant CoWoS packaging for its next-generation tensor processing unit, turning instead to Intel's EMIB-T technology in a move that could reshape the AI chip supply chain.

Stacy Rasgon, a senior semiconductor analyst at Bernstein with 18 years covering the chip industry, declared on June 21 that the semiconductor sector is experiencing the first genuine "supercycle" of his career, as AI-driven demand pushes capacity constraints across every…

ASML CEO Christophe Fouquet warned Wednesday that the chip equipment maker must guard against supply constraints as it prepares to service massive new projects like Elon Musk's Terafab, the planned semiconductor megafactory in Texas.

Apple is planning to equip its high-end 2028 iPhones with chips built on a 1.4-nanometer process, marking the next major leap in its mobile silicon roadmap. Bloomberg's Mark Gurman reported on Monday that the A22 Pro processor will be manufactured…

Intel announced on Tuesday at the 2026 VLSI Symposium in Honolulu that its 18A-P process node has entered risk production on schedule, marking a milestone in the chipmaker's effort to rebuild its contract manufacturing business and attract external customers.

Alphabet's Google has placed an order with Intel to manufacture more than three million tensor processing units for 2028, according to a report from The Information published Monday, citing four people with direct knowledge of the discussions. The deal marks…