TSMC, Samsung, and Intel commit to ASML’s next-gen EUV gear

13 sources
  • ASML announced joint agreements with TSMC, Samsung, and Intel to develop 12-inch photomask technology for High-NA EUV lithography.
  • The roadmap targets a 12-inch mask pilot line by 2031 and full advanced-node production readiness by 2033, replacing the industry's decades-old 6-inch format.
  • Samsung plans to be first to use High-NA EUV in DRAM manufacturing by 2028, while TSMC targets advanced logic nodes from 2030, according to Bloomberg.
Sources (13)
  1. 1 TSMC and ASML Announce Initiative to Pioneer Industry ... www.asml.com
  2. 2 ASML lines up Intel, TSMC and Samsung behind 12-inch masks ... www.digitimes.com
  3. 3 [News] ASML Expands High-NA EUV Push with TSMC, Samsung and ... www.trendforce.com
  4. 4 Samsung Electronics and ASML Expand Strategic Collaboration ... news.samsung.com
  5. 5 ASML Wins Over TSMC, Samsung for New EUV Machines as AI Demand Surges www.bloomberg.com
  6. 6 ASML says first chips made with High-NA EUV machines to ... www.reddit.com
  7. 7 ASML's High-NA EUV Tools: Powering the Sub-2nm Era ... markets.financialcontent.com
  8. 8 ASML Lands Massive EUV Deal Clearing Path to Double ... 247wallst.com
  9. 9 ASML Advances EUV Light Source for 50% More Chips by ... www.linkedin.com
  10. 10 ASML Unveils Plans for Next-Generation "Hyper-NA ... www.techpowerup.com
  11. 11 EUV lithography systems – Products www.asml.com
  12. 12 ASML, TSMC, Samsung and Intel Agree on AI Chip Roadmap ... startupfortune.com
  13. 13 Samsung and ASML Expand High NA EUV Partnership for Next ... www.securities.io