SK Hynix se stává zákazníkem Intelu pro pouzdření čipů AI

25 zdroje
  • SK hynix potvrdila, že spolupracuje s divizí Intel Foundry na integraci pamětí s vysokou šířkou pásma do pouzder EMIB pro čipy AI.
  • Dohoda přichází v době, kdy pouzdření CoWoS společnosti TSMC čelí rizikům výtěžnosti a kapacitním omezením, uvádí Counterpoint Research.
  • Podle průzkumu Counterpointu analytici naznačují, že Google a MediaTek mohou rovněž přijmout technologii EMIB-T od Intelu pro nadcházející tenzorové procesorové jednotky.
Zdroje (25)
  1. 1 Intel Secures SK hynix Next-Gen HBM Memory as EMIB ... www.techpowerup.com
  2. 2 TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say - EE Times www.eetimes.com
  3. 3 Intel, SK hynix shares surge following reports of chip packaging ... www.tomshardware.com
  4. 4 [News] SK hynix Reportedly Tests Intel EMIB 2.5D Packaging With ... www.trendforce.com
  5. 5 Intel makes Advanced Packaging its own foundry focus - igor´sLAB www.igorslab.de
  6. 6 SK hynix Eyes Intel EMIB 2.5D Packaging for HBM Memory www.techpowerup.com
  7. 7 News tagged EMIB at DIGITIMES www.digitimes.com
  8. 8 SK hynix is considering adopting EMIB from Intel : r/intelstock - Reddit www.reddit.com
  9. 9 SK Hynix Teams with Intel to Test EMIB Packaging, Cracks ... finance.biggo.com
  10. 10 Intel EMIB Packaging Gains Traction with Google and SK Hynix www.linkedin.com
  11. 11 SK Hynix Intel EMIB Packaging Research Aims to Diversify AI High ... www.technetbooks.com
  12. 12 Intel & SK Hynix collaborate on EMIB Packaging - Reddit www.reddit.com
  13. 13 SK Hynix Pursues Collaboration with Intel on 2.5D Packaging ... semiwiki.com
  14. 14 SK hynix turns to Intel's EMIB for HBM packaging - LinkedIn www.linkedin.com
  15. 15 SK Hynix Unpacks Advanced Packaging Technologies, Including ... wccftech.com
  16. 16 Advanced Packaging Innovations | Chip Packages - Intel www.intel.com
  17. 17 SK Hynix Unpacks Advanced Packaging Technologies, Including ... wccftech.com
  18. 18 How Intel Foundry Packaging Technologies Redefine AI and HPC ... community.intel.com
  19. 19 SK hynix is testing Intel's EMIB packaging for HBM integration - Reddit www.reddit.com
  20. 20 News Posts matching 'TSV' | TechPowerUp www.techpowerup.com
  21. 21 News Posts matching 'TSMC' | TechPowerUp www.techpowerup.com
  22. 22 News Posts matching 'EMIB-T' - TechPowerUp www.techpowerup.com
  23. 23 SK hynix Eyes Intel EMIB 2.5D Packaging for HBM Memory www.techpowerup.com
  24. 24 Intel's U.S. Advanced Packaging Enables Next-Generation ... newsroom.intel.com
  25. 25 Intel Announces New Packaging and Test Technologies for Foundry ... www.techpowerup.com