SK Hynix and Sandisk release first open standard for high bandwidth flash AI memory

SK Hynix ↘ 3.12% and Sandisk ↘ 3.73% on Tuesday released the industry's first standard specifications for High Bandwidth Flash, a next-generation memory technology designed to ease bottlenecks in AI inference systems by filling the gap between high-bandwidth memory and solid-state drives.

The specification, unveiled at the Future of Memory and Storage 2026 conference in Santa Clara, California, was published through the Open Compute Project as an open industry standard just six months after the two companies launched their HBF consortium in February.koreaherald+1

A New Memory Tier for AI Inference

HBF applies vertical stacking and advanced packaging techniques used in HBM production to NAND flash, delivering bandwidth approaching that of DRAM-based HBM while offering several times the capacity at lower cost per bit. The specification defines two stack configurations using 8 or 16 NAND dies, supporting capacities up to 512 gigabytes. Bandwidth is divided into three performance grades ranging from approximately 0.4 terabytes per second to 3.0 TB/s.koreajoongangdaily+2

The standard adopts Universal Chiplet Interconnect Express as its interconnect, enabling HBF devices to connect with GPUs and CPUs from multiple vendors rather than relying on proprietary interfaces. The specification also covers electrical characteristics, packaging and reliability guidelines, and software input-output requirements.businesswire+2

Industry Backing and Market Context

Google Alphabet Inc. ↘ 3.58% and AI chip startup Tenstorrent have joined the consortium, lending the effort hyperscale credibility from its earliest stages. A panel discussion scheduled for Thursday at FMS will bring together executives from SK Hynix, Sandisk, and Google DeepMind to discuss how HBF can help overcome what engineers call the "memory wall".koreatimes+3

"With the rapid spread of AI applications, we are at a point where overall data processing structures must be redesigned," said SK Hynix Executive Vice President Kim Chun-sung. "Through HBF, SK Hynix will expand the boundaries between memory and storage and contribute to building new architectures that enhance overall system efficiency".koreajoongangdaily+1

Sandisk Chief Technology Officer Alper Ilkbahar called the specification "an important milestone for the HBF ecosystem and for the next generation of AI systems built to improve token economics at scale".businesswire

Road to Commercialization

HBF memory samples are expected in the second half of 2026, with the first inference devices powered by the technology anticipated around early 2027. SK Hynix separately showcased its tenth-generation 375-layer 4D NAND at FMS, which delivers 2.5 times greater performance per watt than its predecessor, with mass production of enterprise SSDs based on the technology planned for early next year.sdxcentral+3

Not all industry players are moving at the same pace. Samsung is developing its own HBF capabilities but expects commercialization to take longer, while Nvidia ↘ 1.47% has pursued a parallel approach through its Inference Context Memory Storage technology already deployed in the Vera Rubin platform. Shares of both SK Hynix and Sandisk rose in Tuesday trading following the announcement.seekingalpha+2