TSMC varsler investering på 31,4 milliarder dollar i brikkeproduksjon

19 kilder
  • TSMC kunngjorde torsdag at de vil bygge tre fabrikker i Longtan for produksjon av brikker under 1,4 nanometer, en investering på over 31,4 milliarder dollar.
  • Utvidelsen kommer etter rekordtall for andre kvartal, med en omsetningsvekst på 36 prosent, drevet av høy etterspørsel etter AI-relatert datakraft.
  • Selskapet øker også investeringsbudsjettet for 2026 til 60–64 milliarder dollar og planlegger å doble kapasiteten for avansert innpakning innen 2028.
Kilder (19)
  1. 1 Taiwan Semiconductor (TSM) Plans Expansion with $31.4 Billion In www.gurufocus.com
  2. 2 Dan Nystedt x.com
  3. 3 Taiwan Semiconductor Q2 Earnings: AI Infrastructure Demand Sets the Stage for Decade-Long Compounding news.alphastreet.com
  4. 4 TSMC may double CoWoS capacity by 2028 amid AI chip demand | Communications Today www.communicationstoday.co.in
  5. 5 TSMC is accelerating Arizona fab buildout to capitalize on AI ... www.cnbc.com
  6. 6 Report: TSMC to Double CoWoS Capacity by 2028 as AI Chip ... wccftech.com
  7. 7 TSMC reportedly plans to double CoWoS capacity by 2028 - RCRTech rcrtech.com
  8. 8 TSMC Longtan science park discussions begin again - Taipei Times www.taipeitimes.com
  9. 9 TSMC’s $165 Billion Arizona Expansion: Inside the GigaFab ... tech-insider.org
  10. 10 TSMC to start building 1.4nm fabs in Taiwan in 2026 www.taiwannews.com.tw
  11. 11 TSMC Intends to Expand Its Investment in the United States to ... pr.tsmc.com
  12. 12 TSMC Board Greenlights Q1 Dividend and Massive US$31 Billion ... www.tipranks.com
  13. 13 TSMC's CoWoS Capacity to Double to 260000 Wafers by 2028 finance.biggo.com
  14. 14 TSMC Reportedly Plans to Double CoWoS Capacity by 2028 as AI ... www.digitalcitizen.life
  15. 15 TSMC expands CoWoS capacity - Advanced Packaging News advancedpackaging.news
  16. 16 Report: TSMC to Double CoWoS Capacity by 2028 as AI Chip ... www.reddit.com
  17. 17 Theodore Aggelopoulos, MBA's Post - LinkedIn www.linkedin.com
  18. 18 TSMC CoWoS Capacity 2026: Sold Out, 2nm Booked siliconanalysts.com
  19. 19 [News] TSMC Advances Panel-Level Packaging, CoPoS Pilot Line ... www.trendforce.com