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The European Union's sweeping Packaging and Packaging Waste Regulation begins applying on August 12, introducing restrictions on "forever chemicals" in food-contact packaging and requiring sellers to register individually in each of the 27 member states where they ship products —…

TSMC Taiwan Semiconductor Manufacturing Company Limited is ramping up outsourcing of its advanced CoWoS packaging process to outside partners as surging demand from AI chip makers like Nvidia and AMD Advanced Micro Devices, Inc. pushes its internal capacity to near-full…