„Huawei“ paskelbė masinės gamybos duomenis, pagrindžiančius „Tau“ mastelio dėsnį

22 sources
  • „Huawei“ puslaidininkių padalinio vadovė He Tingbo liepos 3 d. išleido „Tau“ mastelio dėsnio (Tau Scaling Law) dokumento 2-ąją versiją, papildytą inžinerinėmis detalėmis ir masinės gamybos matavimais.
  • Dokumentas remiasi gegužę pristatyta sistema, kurioje geometrinis tranzistorių mažinimas pakeičiamas signalo sklidimo laiko optimizavimu naudojant 3D lustų krovimą.
  • „Huawei“ teigia, kad jos „LogicFolding“ architektūra debiutuos „Kirin“ lustuose šį rudenį ir tvirtina, kad iki 2031 m. ji galės prilygti 1,4 nm tranzistorių tankiui be pažangios litografijos.
Sources (22)
  1. 1 Huawei Releases "Tao's Law" V2 Paper: Debuts Mass Production ... finance.biggo.com
  2. 2 Huawei Publishes V2 of "Tao's Law" Paper, Laying Out a New Path ... x.com
  3. 3 HUAWEI Presents the Tau (τ) Scaling Law, Enabling Breakthroughs ... www.huawei.com
  4. 4 Huawei's Tau Scaling Law Challenges Logic Leaders futurumgroup.com
  5. 5 From Shrinking Transistors to Compressing Time: Huawei's τ Law www.eetimes.com
  6. 6 He Tingbo published a V2 of the Tao Law paper on ChinaXiv ... x.com
  7. 7 Huawei's He Tingbo released the V2 version of the "Tao Law" paper ... longbridge.com
  8. 8 Huwaei's New LogicFolding Chip Might Destroy The ... - YouTube www.youtube.com
  9. 9 SemiAnalysis x.com
  10. 10 Huawei's Tau Scaling Is Really a Hybrid Bonding Bet - Vik's Newsletter www.viksnewsletter.com
  11. 11 τ Scaling: Huawei's New Growth Engine for the Post-Moore Era www.techflowpost.com
  12. 12 Huawei's new gamble to break the US's chip blockade - ThinkChina.sg www.thinkchina.sg
  13. 13 Huawei plans 1.4-nm chips by 2031, Kirin 2026 Chip - SemiWiki semiwiki.com
  14. 14 Huawei Unveils Tau Scaling Law at ISCAS 2026, Proposing a New ... techsauce.co
  15. 15 HUAWEI Presents the Tau (τ) Scaling Law, Enabling Breakthroughs ... www.reddit.com
  16. 16 He Tingbo, president of Huawei's semiconductor business ... www.facebook.com
  17. 17 Huawei Unveils Tau (τ) Scaling Law: Aiming for 1.4nm-Equivalent ... leonliao.substack.com
  18. 18 huawei on Instagram: "He Tingbo shares in an interview how she ... www.instagram.com
  19. 19 Huawei Reveals Hybrid Bonding Process For The Kirin 2026's 3D ... www.reddit.com
  20. 20 Huawei's Chip Breakthrough: Genuine Leap or Strategic Hype? techsoda.substack.com
  21. 21 With HUAWEI Kirin 2026 launching later this year ... - Instagram www.instagram.com
  22. 22 During her presentation of the Tau (τ) Scaling Law, HUAWEI's He ... www.instagram.com

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